The LTE Reference design by Lekha is UE Category 4 compliant. Using this Reference Design, OEMs can build LTE UEs for different form factors like a Handset, Man-pack or Outdoor type. LTE UE from Lekha supports most of the significant & mandatory features specified by 3GPP, for Release 8 and Release 9 versions of the standard. Lekha’s UE solution adopts a modular design.

Lekha LTE UE  reference design software package includes:

  • Lekha’s UE-PHY (Layer 1) Compliant to 3GPP Release 9

  • Lekha’s UE-HLS (Layer 2 & Layer 3) Compliant to 3GPP Release 9

Layer 1 is optimized for TI’s C66x DSP core. The design is flexible to scale the UE categories across various Keystone II platforms and other general purpose DSPs from TI. Layer 1 supports QAM64 highest MCS along with MIMO to demonstrate best throughputs. Transmission modes  like SISO & MIMO (SM and SFBC) are supported. Layer 1 and Higher Layer Software(HLS) are interfaced with an interface similar to FAPI.

The L2 & L3 or HLS can be ported across multiple embedded platforms and across different flavors of Real Time OS.

System level Features

  • 3GPP Release 9 compliant

  • Category 4

  • 2×2 MIMO

  • 2 Tx and 2 Rx

  • 5,10 and 20 MHz bandwidth support

  • Maximum RF out power is 23dBm

  • TDD / FDD mode supported

  • All 3GPP RF bands are supported

The LTE UE reference design has inter worked with multiple eNBs and T&M equipment. Supports radio integration with different families of radio chips lilke  AFE7500, AD936x and AD937x from Texas Instrument and Analog Devices.

The UE solution is backed by few patents filed by Lekha with respect to PSS and SSS synchronization and Turbo Decoder. UE HLS is offered with framework for protocol verification against ETSI conformance test suite.

Platform
Lekha’s LTE UE uses COTS HW reference platform.

Lekha’s L2L3 stack is optimized for realtime operation on x86 and ARM multicore platforms. It also can operate in PC based environment for non realtime MAC-MAC testing with any eNB stack.

Lekha has several RTL IP components that realize LTE functionalities on FPGA. These IPs can be used for easy migration of the UE stack to a non Keystone II based HW architecture.

TCI6630K2L EVM for Base Band Processing
The TCIEVMK2LX Evaluation Module (EVM) is a high performance, cost-efficient, standalone development platform that enables users to evaluate and develop applications for the TI’s Keystone II SoC. The TCIEVMK2LX Evaluation Module (EVM) also serves as a hardware reference design platform for the TCI6630K2L SoC. The SoC has TI’s Four C66x DSP Cores + Two ARM Cortex A15 Cores.
K2Levm
AFE7500 EVM as Radio Front End
The AFE7500 Evaluation Module, abbreviated as AFE7500-EVM, is a board designed for the evaluation of the Integrated Transceiver AFE7500 from Texas Instruments Inc. The AFE7500-EVM incorporates all required circuitry and components with the following features.

  1. Zero-IF transceiver (2T+2R RF-to-Bits Conversion)
  2. 40 MHz RF traffic bandwidth
  3. Supports all 3GPP Bands (Rel. 9 &10)
  4. Integrated Feed Back Receiver Path
    • Feedback for external Digital Pre Distortion(DPD)
    • 5x Expansion Bandwidth
    • Independent Network Listening Mode
  5. JESD204B Interface with Multi-Rate SerDes
Marconi