Lekha’s UE-PHY (Layer 1) Compliant to 3GPP Release 9
Lekha’s UE-HLS (Layer 2 & Layer 3) Compliant to 3GPP Release 9
Layer 1 is optimized for TI’s C66x DSP core. The design is flexible to scale the UE categories across various Keystone II platforms and other general purpose DSPs from TI. Layer 1 supports QAM64 highest MCS along with MIMO to demonstrate best throughputs. Transmission modes like SISO & MIMO (SM and SFBC) are supported. Layer 1 and Higher Layer Software(HLS) are interfaced with an interface similar to FAPI.
The L2 & L3 or HLS can be ported across multiple embedded platforms and across different flavors of Real Time OS.